Chip Off Machine
Call (888) 406-2830 for answers to your questions.
Digital Forensics Cell Phone Chip Off Machine. With the Model SV530 you can easily remove and place BGAs, CGA's, CSPs, QFPs, LGA's and Other SMD's using this color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus.
Model SV530 BGA Chip Off Machine
- Fits Boards up to 20"
- Places components from 1mm to 70mm
- 1200 watt component heater (Top Side)
- 800 watt component heater (Bottom Side)
- 2400 Watt IR underheater
- Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
- Color optical system with functions of split vision, zoom in/out and micro-adjust.
- Auto focus and software operation camera.
- Fully self contained with PLC control. No need for external air.
- Plug in and ready to use.
- One year parts warranty.
- Lifetime technical support.
- 7pcs nozzle set. (5 for upper heater, 2 for lower heater)
- 5 different size component pick up tubes
- Universal reball fixture with standard stencil set.
- 2-Jars of solder balls.
- 1-75 gram jar of tacky flux.
In stock! Chip off process training is also available.